| 摘要 |
PURPOSE:To improve the wetting which respect to an element in the case of diebonding the semiconductor element as the whole rear of the element by a method wherein the stamping surface of a stamp spreading silver paste on a substrate mounting the semiconductor element is divided into multiple regions. CONSTITUTION:A rubber sheet 2 is bonded to the bottom surface of stamp base 1. The stamping surface of rubber sheet 2 opposing to the bonded surface is divided into four flat regions 2a by a cross dividing groove 3. Resultantly, the wetting 6 of semiconductor element corresponding to the small regions 2a can be distributed evenly thus improving the bonding property of diebond markedly.
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