发明名称 MANUFACTURE OF COPPER BASED LEAD FRAME MATERIAL FOR INTEGRATED CIRCUIT
摘要 PURPOSE:To improve machinability and to increase strength, by performing finishing comprising compressing machining of a raw strip after the final annealing in the direction of the width and rolling in the longitudinal direction, and reducing anisotropy in the direction of the width and in the longitudinal direction. CONSTITUTION:Finishing comprising compressing machining of a raw strip in the width direction after the final annealing and rolling in the longitudinal direction is performed. Therefore, anisotropy becomes less, the machinabilities and the strengths in the longitudinal direction and the width direction become approximately equal. Package machining such as QFD (quad flat package) and PLCC (plastic leaded chip carrier) can be performed. Namely, a machining rate, which is larger than that in the machining in one direction, can be applied by combining the compressing machining for providing the width and the ordinary rolling. Thus the level of the strength can be increased.
申请公布号 JPS63124558(A) 申请公布日期 1988.05.28
申请号 JP19860271268 申请日期 1986.11.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORI TOSHIHIKO;KUBOZONO KENJI
分类号 H01L23/50 主分类号 H01L23/50
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