发明名称 RESIN SEALED PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To protect an outer lead terminal from a deforming force coming from the outside by a method wherein the outer lead terminal, except its portion not thicker than a brazed portion, and almost the entirety of a first resin seal section are covered a second resin seal section. CONSTITUTION:A second resin seal section 5 covers the entire surface of a first resin seal section 1, except its upper surface, and an outer lead terminal 2, with a portion 20a not thicker than a brazed portion 2a at the outer lead terminal 2 left exposed. To mount a package on a substrate, such a braze as solder may be used and junction is made on the lower surface of the exposed portion 20a of the brazed portion 2a of the outer lead terminal 2. as in a conventional design. With the majority of the outer lead terminal 2 being covered by the resin seal section 5, the second resin seal section 5 protects the outer lead terminal 2 from deformation due to an outer force during a performance test or transportation. Possibilities are eliminated of short-circuiting after mounting.
申请公布号 JPS63110661(A) 申请公布日期 1988.05.16
申请号 JP19860256409 申请日期 1986.10.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKEMURA SEIJI
分类号 H01L23/29;H01L23/31;H05K3/28;H05K3/34 主分类号 H01L23/29
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