发明名称 ELECTROPLATING BATH
摘要 PURPOSE:To provide an electroplating bath suitable for use in the production of a perpendicular magnetic recording medium by adding ions of Co, Mn, Ni and Re as principal components, a reducing agent, a pH buffer and a pH adjusting agent. CONSTITUTION:An electroplating bath contg. about 0.42mol/l cobalt chloride, about 0.03mol/l manganese sulfate, about 0.04mol/l nickel chloride, about 0.14mol/l sodium hypophosphite, about 1.87mol/l ammonium chloride and about 0.007mol/l ammonium perrhenate is prepd. The plating bath is used to plate a substrate having a nonmagnetic Ni-P layer at about 3.7pH (25 deg.C), about 50 deg.C and about 4A/dm<2> current density.
申请公布号 JPS63111195(A) 申请公布日期 1988.05.16
申请号 JP19860256390 申请日期 1986.10.28
申请人 SHIN ETSU CHEM CO LTD 发明人 TANABE YOSHINARI;IIDA TAMAKI
分类号 C25D3/56;G11B5/858;H01F10/16;H01F41/26 主分类号 C25D3/56
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