| 摘要 |
In a boiling-and-cooling device for semiconductor components based on a boiler cooling with a heat sink (1) which contains, in a cavity (4), a cooling liquid (8) which is in intimate thermal contact with the semiconductor component (6) to be cooled, the semiconductor component (6) is mounted outside the cavity (4). The heat is introduced into the cooling liquid (8) by a heat removing device (5) which seals the cavity (4) on one side and is insulated from the heat sink. This device achieves a simple, compact construction and at the same time high modular flexibility. <IMAGE> |
