| 摘要 |
PURPOSE:To promote the improvement of polishing accuracy and to easily correct a surface plate, by constituting a polishing device of a bottom surface plate rotatable on a bed, base bed accurately moving on a column in the axial direction and the radial direction of the bottom surface plate and a tool head able to mount an upper surface plate and a correcting tool to and remove them from said base bed. CONSTITUTION:In case of lapping a work of wafer or the like, the work is lapped in a condition that an accurate feed in the lateral direction and/or longitudinal direction is applied to an upper surface plate by a polishing device mounting the upper surface plate to a tool head 15 and turning a bottom surface plate 2 and the upper surface plate further as necessary moving a sliding bed 8 and/or a base bed 12. In this way, the work can be very high accurately polished cooperatively with supporting by an air spindle of the bottom surface plate 2 and its cooling. While the bottom surface plate 2, when it is worn, performs its self-grinding or self-cutting by mounting a grinding wheel or a tool to the tool head 15. Accordingly, the bottom surface plate 2, whose correction can be easily further correctly performed with no necessity for its removal, enables high accuracy control to be performed. |
