发明名称 COOLING SYSTEM FOR INTEGRATED CIRCUIT ELEMENT
摘要 PURPOSE:To increase the heating area and a heat transfer rate between a heating surface and a refrigerant, and to improve cooling capacity by extending a heat exchanger plate in the direction of a flexible elastic structure, forming a recessed section and shaping a predetermined space between the bottom end of the flexible elastic structure and the base of the heat exchanger plate. CONSTITUTION:When a refrigerant such as water is flowed through a refrigerant path 2, the refrigerant is injected against a heat exchanger plate 5 mounted at the bottom end of a flexible elastic structure 4 by a nozzle 3 projected from the refrigerant path 2. The heat exchanger plate 5 and an integrated circuit element 6 are pushed directly or indirectly, heat generated from the integrated circuit element 6 mounted onto a substrate 7 is spread in the direction of the flexible elastic structure 4 and transmitted over the base section and both side surface sections of the heat exchanger plate 5 shaping a recessed section, and the refrigerant robs the base section and both side surface sections of the heat exchanger plate 5 of heat, thus cooling the integrated circuit element 6. A guide 21 improves positional precision in the horizontal direction of the heat exchanger plate 5, and prevents vibrations, movement, etc. in the horizontal direction.
申请公布号 JPS6364348(A) 申请公布日期 1988.03.22
申请号 JP19860208727 申请日期 1986.09.04
申请人 FUJITSU LTD 发明人 SUZUKI MASAHIRO;YAMAMOTO HARUHIKO
分类号 H01L23/473;H01L23/433 主分类号 H01L23/473
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