| 摘要 |
FIELD: physics, radio. ^ SUBSTANCE: device for heat dissipation at radio electronic device elements relates to heat dissipation devices and can be applied in heat sink at microcircuits or other small-sized radio electric items mounted on printed boards. Device includes metallised area 1 with metallised orifices where heat conducting rods in the form of brackets 2 are welded. Microcircuit 3 is mounted at the same metallised area 1 over heat conducting paste. Number of brackets 2 and diametre of copper wire used to make brackets 2 depend on free board area and dissipation rate of microcircuit 3. Area 1 can take any shape. Height of brackets 2 is determined by unit case 4 height, as their tops contact internal case surface. ^ EFFECT: enhanced efficiency of heat dissipation, simplified construction. ^ 1 dwg |
