| 摘要 |
PURPOSE:To realize a suitable and easy inspecting method for defects by brining a test board which has the same conductor pattern with the conductor wiring part and/or terminal part of a board for package into contact with the board for package to be inspected. CONSTITUTION:A conductor pattern 9 corresponding to the pattern of the conductor wiring part 5 of a printed wiring board 1 is formed on the surface of the test board 8. Terminals 11 formed on a board constituting the test board 8 are connected to the pattern 9 by wiring. When an inspection is performed, the conductor pattern 9 of the test board 8 and the conductor wiring part 5 of the printed wiring board 1 are brought into contact with each other so that the surface of the test board 8 where the conductor pattern 9 is formed and a surface of the printed wiring board 1 to be inspected contact each other. Then, the terminal 11 of the test board 8 are connected to an inspecting instrument 13 electrically by wiring 14 and the inspecting machine 13 performs the defect inspection of the conductor wiring part 5 of the printed wiring board.
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