发明名称 TEMPERATURE CONTROL DEVICE FOR ELECTROLESS PLATING SOLUTION
摘要 PURPOSE:To automatically obtain fixed plating thickness within a constant plating time by setting up the temperature of plating based on information obtained from a counter for counting up the number of times of using a plating solution and a pH controller for informing the pH of the plating solution. CONSTITUTION:The counter 3 receiving a signal from a plating solution usage recognizing device 2 for recognizing the existence of usage of the plating solution to be reset at the time of replacing the plating solution counts up and outputs the number of times of using the plating solution. The pH controller 4 outputs the pH value of the current plating solution to a temperature setting device 5. The device 5 determines the optimum plating temperature from the using frequency of the plating solution obtained from the counter 3 and the pH value obtained from the controller 4 and outputs the optimum plating temperature signal to a temperature control device 6. The device 6 executes temperature control matched with the deterioration of the plating solution 1 and the pH of the current plating solution to obtain the fixed plating thickness within the constant plating time.
申请公布号 JPS62284411(A) 申请公布日期 1987.12.10
申请号 JP19860127811 申请日期 1986.06.02
申请人 SEIKO EPSON CORP 发明人 URANO YASUHIRO
分类号 G05D23/00 主分类号 G05D23/00
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