| 摘要 |
PURPOSE:To provide a coating material which yields a resin film having a high curing rate and small decrease of Young's modulus at a high temp. by incorporating a specific di(meth)acrylate therein. CONSTITUTION:The di(meth)acrylate (A) expressed by the formula (R1-2 are H, CH3; R3-4 are H, alkyl of 1-10C; a, b are 1-3, and the average total value of a+b is 2-6) is obtd. by bringing the addition product of a dialkyl hydantoin and alkylene oxide of 2-3C or the resulted product of the decarbonization reaction of the dialkyl hydantoin and alkylene carbonate and (meth)acrylic acid into reaction. Then, 5-50wt% component A, 40-90wt% ethylenic unstd. compd. (e.g.: isobornyl acrylate) (B), and if necessary 0.1-10wt% photopolymn. initiator (e.g.: benzyl dimethyl ketal) (C), 0-10wt% resin for modification (e.g.: epoxy resin) (D) and 0-3wt% org. silicon compd. (e.g.: gamma-methacryloxypropyl trimethoxysilane) (E), etc., are mixed.
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