| 摘要 |
PURPOSE:To form a metal-based carrier, a dielectric board, and a cap into an airtight structure by a method wherein the dielectric board is provided with a micro-strip line on its front surface and a coplanar line on its rear surface and the two lines are connected with through-holes provided in the dielectric board. CONSTITUTION:A dielectric board 2 with its middle portion removed is installed on a carrier 1 provided with a recess, a microwave device is accommodated in the cavity in the dielectric board 2, and then a cap 5 is installed for the realization of airtight sealing. A front-side cap-installing metal film 9 connects to a rear-side grounding metal film 12 when a first through-hole 10 is filled up with metal. A front-side microwave device installing metal film 8 connects to an end of a rear-side coplanar line 13 connects, and a front-side input/output metal film 4 to the other end of the rear-side coplanar line 13, when a second through-hole 11 is filled up with metal. |
