| 摘要 |
PURPOSE:To improve the packaging density of a semiconductor pellet, by providing an insulating film on the back surface of the semiconductor pellet, and making it possible to form a wiring beneath the semiconductor pellet. CONSTITUTION:A semiconductor pellet, on a back surface of which an insulating film is formed, is mounted. For example, in the inside of a package 1, which is molded with a resin such as epoxy resin, a semiconductor pellet 3, on the back surface of which an insulating film 2 comprising silicon dioxide is formed, is sealed. Electrode pads 2a of the semiconductor pellet 3 and leads 4 are electrically connected through wires 5 made of gold and the like. The semiconductor pellet 3 is bonded to the leads 4, which are arranged beneath the pellet, through an insulating bonding agent 6 comprising beneath the pellet, through an insulating bonding agent 6 comprising epoxy resin. The leads 4 are continued to external leads 4a, which are extended to the outside of the package 1. |
