发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 PURPOSE:To enable resist to be developed uniformly, by supplying a developing solution from the bottom face of a temperature-regulating plate and causing the developing solution to be held between the wafer and the temperature- regulating plate. CONSTITUTION:A temperature-regulating plate 2 is arranged at a certain distance from a wafer 1. A developing solution is dripped from a nozzle 6 provided at the center of the rear face of the temperature-regulating plate 2. The dripped developing solution is held between the wafer 1 and the temperature-regulating plate 2 to form a layer with a uniform thickness by the effect of surface tension. Since the temperature-regulating plate 2 is held at a fixed temperature by circulation of temperature-regulating water 4, the developing solution 3 is also held at a fixed temperature and, therefore, resist on the wafer 12 can be developed uniformly under constant conditions.
申请公布号 JPS62133720(A) 申请公布日期 1987.06.16
申请号 JP19850275525 申请日期 1985.12.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 NOSAKA MASAHIRO
分类号 H01L21/30;G03F7/00;G03F7/30;H01L21/027 主分类号 H01L21/30
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