| 摘要 |
PURPOSE:To avoid scattering of molten solder onto leads by forming a projection having a height equal to or higher than the upper surface of a semiconductor chip and an oblique side face on the tips of inner leads and hanging leads of a lead frame for mounting the chip at die pad side. CONSTITUTION:A die pad 12 surrounded by inner leads 13 and hanging leads 15 is provided as ordinarily on a lead frame 11, and a semiconductor chip 4 is secured onto the pad 12. Then, when electrode wirings formed on the chip 4 are bonded to the leads 13, 15 via fine metal wirings 6, the shape of the bonding portions of the leads 13, 15 is formed as below. Projections 14, 16 having a height equal to or higher than the chip 4 are formed on the bonded portions, and oblique surfaces 14a, 16a are formed on the sides. Thus, when the chip 4 is secured with a solder 5, scattered solder 5 does not jump to the bonded portions. |
