| 摘要 |
<p>Apparatus and method for cooling a low temperature circuit substrate (20) without the need for a vacuum chamber or total immersion, involving subjecting the circuit (22) to a stream of cold fluid (14) such as liquid helium, and allowing the fluid thereafter to dissipate into the surrounding environment. The apparatus may include an enclosure for holding the circuit (22), and means for guiding (40) the fluid onto another portion of the substrate after it strikes the circuit. The exit path for the fluid may fold back past the circuit so as to help convect out heat which enters the vicinity radially from the outside.</p> |
