发明名称 METAL ION IRRADIATION SYSTEM
摘要 PURPOSE:To form a highly accurate wiring, by replaceably filling the apparatus with such gas as having low molecular weight or atomic weight after prelimi nary evacuation, thereby considerably reducing the irradiating position error due to scattering of metal ions. CONSTITUTION:In order to reduce the irradiating position error of metal ions due to scattering caused by the collision of the residual gas molecules with the metal ion after evacuation in the apparatus, it is replaced with gas having low molecular weight or atomic weight after preliminary evacuation. When the apparatus is evacuated quickly to 10<-8>mmHg as preliminary evacuation and filled with hygrogen gas or helium gas having low molecular weight or atomic weight upto 10<-6>mmHg, for example, discharge of adsorbed macro molecular gas molecules can be suppressed considerably although the discharge quantity and the discharge pressure limit of the adsorbed gas molecules are different according to the quality and shape of material in the apparatus and the quality of printedboard. Consequently, the irradiating position error of metal ions against a prinedboard due to the collision of the metal ions with the resid ual gas after evacuation can be reduced considerably.
申请公布号 JPS62105351(A) 申请公布日期 1987.05.15
申请号 JP19850245620 申请日期 1985.11.01
申请人 HITACHI PLANT ENG & CONSTR CO LTD 发明人 MASUDA JUNICHI
分类号 G21K5/04;H01J37/317;H05K3/14 主分类号 G21K5/04
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