| 摘要 |
<p>PURPOSE:To provide the titled compsn. having excellent moisture resistance after thermal stress and suitable for use in sealing semiconductors, by adding a specified silica filler and synthetic rubber. CONSTITUTION:An epoxy resin is blended with silica having a weight-average particle size of 15mu or below and the max. particle size of 100mu or below as a filler, 0.1-20wt% synthetic rubber contg. at least two epoxy groups per molecule (e.g., 1,4-trans polybutadiene contg. epoxy groups at both terminals), a hardener, a curing accelerator, a parting agent, a flame retarder, a pigment, etc.</p> |
