| 摘要 |
<p>An adhesive composition containing: (a) a nitrogen atom-free epoxy compound, (b) a poly N-glycidyl type epoxy resin, (c) a nitrile rubber having a carboxyl group, and optionally (d) a finely divided silica, a clay substance treated with an onium compound, or a mixture thereof. The compounding ratio by weight of the components (a), (b), (c) and (d) is as follows: 0.05</=(b)/(a)</=19 0.05</=[(a)+(b)]/(c)</=1.75 0.0125</=(d)/(c)</=0.75 This adhesive composition has excellent adhesion strength, soldering heat resistance, flexibility, and chemical resistance, and has a small resin flow property.</p> |
