SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the possibility of occurrence of peeling between a semiconductor chip and an insulating resin, particularly the problem of reliability under heating environment after substrate mounting because the surfaces of the semiconductor chip and the insulating resin are exposed in a chip-shaped semiconductor device. SOLUTION: Since the semiconductor device is formed in constitution in which the peripheral section 12a of the semiconductor chip 12 is not coated with an insulating resin layer 16 and the scribing-line ends of the main-surface end section of the semiconductor chip 12 are exposed, the peeling between the insulating resin layer 16 and the semiconductor chip 12 is prevented, and the generation of the peeling under heating environment in the case of substrate mounting is inhibited and reliability can be improved. The width of the peripheral section 12a of the semiconductor chip 12 exposed from the insulating resin layer 16 has a fixed distance, and the peeling among components due to the end-face impulses of the semiconductor device can be prevented.