发明名称 EPOXY RESIN LIQUID COMPOSITION FOR SEALING ELECTRONIC PART
摘要 <p>PURPOSE:The titled composition, obtained by incorporating a liquid epoxy resin with a specific curing agent, spherical silica having the treated surface and curing accelerator in a specific proportion, having good molding operability and capable of giving cured articles having improved moisture resistance and heat-resistant impact resistance. CONSTITUTION:A liquid epoxy resin composition consisting of (A) 100pts.wt. liquid epoxy resin, preferably having 120-300 epoxy equivalent and 250-700 molecular weight, (B) 30-150pts.wt. preferably 50-100pts.wt. at least one curing agent selected from acid anhydrides and phenolic novolak resin, preferably methylhexahydrophthalic acid anhydride and the phenolic novolak resin preferably having 100-110 hydroxyl group equivalent, (C) 20-70vol%, based on the total composition, spherical silica having the surface treated with an alkoxysilane, preferably phenyltriethoxysilane and (D) 0.01-10pts.wt., preferably 0.1-5pts.wt. curing accelerator, preferably triphenylphosphine.</p>
申请公布号 JPS61296020(A) 申请公布日期 1986.12.26
申请号 JP19850137685 申请日期 1985.06.26
申请人 TOSHIBA CORP 发明人 UCHIDA TAKESHI;YOSHIZUMI AKIRA;MATSUMOTO KAZUTAKA
分类号 C08G59/00;C08G59/42;C08G59/62;C08K9/06;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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