发明名称 研削装置
摘要 PROBLEM TO BE SOLVED: To provide a grinding device capable of grinding a workpiece to a uniform finish thickness.SOLUTION: A grinding device is configured to grind a workpiece 11, and includes: grinding means 10 including a chuck table 46 having a conic holding surface 68a for holding the workpiece 11 and including a conic shaft of the holding surface 68a as a rotary shaft 46a, a spindle 21 driven to rotate, and a grinding wheel 24 mounted at a tip of the spindle 21, and grinding a grinding region of the workpiece 11, held on the chuck table 46, from the center to the outer periphery of the holding surface 68a; load current value detecting means of detecting a load current value of the spindle 21; tilt changing means of changing the tilt of the chuck table 46; and control means of controlling the tilt changing means based upon the load current value detected by the load current value detecting means.
申请公布号 JP5943766(B2) 申请公布日期 2016.07.05
申请号 JP20120173616 申请日期 2012.08.06
申请人 株式会社ディスコ 发明人 井上 雄貴
分类号 B24B41/06 主分类号 B24B41/06
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