| 摘要 |
PURPOSE:To effectively prevent a solder bridge between leads of electric components by a simple method by coating a flux on leads of the components, bonding a solder member of powder state on the surfaces of the leads, and heating the leads to melt the member to form a solder layer. CONSTITUTION:A flux 5 is coated on the leads 3 of an electronic component 1, the leads 3 are contacted with a solder member 6 of powder state to bond the member 6 on the surfaces of the leads 3, and heated to melt the member 6, thereby forming a solder layer 6a. For example, the leads 3 led from the resin 4 of the component 1 is dipped in flux solution, and removed to coat flux 5 on the surfaces of the leads. Then, when the leads 3 are dipped in the member 6 of powder form of floated state, the member 6 is wetted with the flux 6 and bonded. Then, the leads 3 are heated to melt the member, the layer 6 is formed to complete soldering. |
