| 摘要 |
PURPOSE:To stabilize a plating liquid and to obtain a molded article having a metallic coating excellent in adhesive force by specifying the metal concn. of plating metallic salt in the plating liquid contg. the metallic salt, a reducing agent and a salt component as a buffer agent. CONSTITUTION:The surface of a synthetic resin molded article is subjected to the sensitization treatment and successively to the activation treatment and thereafter the chemical plating is performed thereto. This chemical plating liquid is made of three components consisting of plating metallic salt A such as NiSO4, a hypophosphite series reducing agent B and Na2SO4 (an acid component is same salt as the plating metallic salt.) as a buffer agent C. Also it is regulated so that the metal concn. mol/l of the plating metallic salt A is made to 0.001<A<0.03. Furthermore each molar ratio of the plating metallic salt A, the reducing agent B and the salt C is preferably regulated to B/A>0.5, C/A>0.25. In this method, the plating metal is not deposited in the parts other than the surface of the molded article. The synthetic resin molded article having the metallized surface obtained by this method is preferable for an electrically- conductive molded article and a shielding material or the like. |
