| 摘要 |
PURPOSE:To obtain the titled composition giving extremely high fluidity in semiconductor molding, capable of providing molded products of small flash formation, low thermal expansion coefficient and high crack resistance, by blending phenol-curable epoxy resin and specific quartz filler. CONSTITUTION:The objective composition can be obtained by blending (A) 100pts.wt. of a phenol-curable epoxy resin and (B) 100-500pts.wt. of quartz filler consisting of (i) 1-80wt% of spherical quartz powder with an average size 1-25mum and (ii) 20-99wt% of ground quartz powder with the fraction representing a size >=20mum being <=10wt% and that representing a size >=1mum being <=15wt%.
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