| 摘要 |
<p>PURPOSE:To obtain a package for an integrated circuit, which can accommodate an integrated circuit element, whose power consumption is large, by directly contacting the back surface of the integrated circuit element to heat radiating fins, thereby improving heat radiating efficiency. CONSTITUTION:In this package, an integrated circuit element 1 is mounted on a multilayer wiring substrate 2 by way of solder bumps 3, which are provided on the entire circuit forming surface. Pins 5 are provided on the surface of the multilayer wiring substrate 2 opposite to the integrated circuit element 1. The pins are inserted in a printed circuit board 4 and electrically connected. Heat radiating pins 6 are connected to the back surface of the integrated circuit element 1 through a contact surface 9. A plurality of the heat radiating fins 6 are continued to a base part 10, and a narrow unitary body is formed. The contact layer 9 is provided at the central part. The peripheral part is fixed to a bellows shaped spring 8. Since the integrated circuit element 1 is directly contacted with the heat radiating fins 6 in this structure, heat resistance from the integrated circuit element 1 to the heat radiating fins 6 becomes small and the heat radiating effect is improved. Thus the element, whose power consumption is large, can be mounted.</p> |
