发明名称 PRODUCTION OF SURFACE WAVE DEVICE
摘要 PURPOSE:To reduce the generation of defective cracks sharply at the time of cutting by forming two layers consisting of a metallic film and a resist ink film which are successively laminated on the other main surface of a glass plate, irradiating laser to the surface of the resist ink film to form a cutting groove and then cutting off the glass plate. CONSTITUTION:Plural pairs of input side inter digital electrodes 12 and output side inter digital electrodes 13 are formed on one main surface 11a of the glass plate 11 and two layers consisting of the metallic film 15 such as Ni and the resist ink film 16 formed on the film 15 are formed on the other main surface 11b. Then, laser is irradiated to the glass plate 11 forming the films 15, 16 on its main surface 11b from the surface of the film 16 to form the cutting groove 17. The glass plate 11 is cut off at the cutting groove 17 to separate surface wave devices.
申请公布号 JPS61253908(A) 申请公布日期 1986.11.11
申请号 JP19850095120 申请日期 1985.05.02
申请人 MURATA MFG CO LTD 发明人 SUZUKI KENJI
分类号 H03H3/08 主分类号 H03H3/08
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