THERMOPLASTISCHES LOETMITTEL UND VERFAHREN UND VORRICHTUNG ZU DESSEN VERWENDUNG

摘要

The soldering material (LM) is produced from fine-grained soldering metal (MG) and a thermoplastic bonding material (BM) in a plastifier (P). It is applied to the object (LG) to be soldered (e.g. printed circuits or components) through screen process (SD) application. Below the plastification temperature (TP) the object to be soldered can be stored or transported at will. The soldering object (LG) is fitted with components (BE) in a heat zone (HZ). After additional storage (L1) and transport (T1) at low temperature, at which the components (BE) are fixed using the bonding material (BM), the bonding material (BM1) may be decomposed and volatilized in a soldering zone (LZ) at a temperature above the soldering and vaporization temperature (TF).