| 摘要 |
PURPOSE:To give high conductivity, and to increase breaking strength on the connection of a bonding wire by depositing copper or a copper alloy through electroplating or electroless plating and manufacturing the titled bonding wire. CONSTITUTION:Copper or a copper alloy is deposited directly through electroplating or electroless plating without using a seed wire and a bonding wire having 20-25mumphi is manufactured, or an extremely small-gage wire (5-20mumphi) acquired by drawing and machining copper, nickel, aluminum or an alloy based on these elements is employed as a seed wire, and the extremely small-gage wire is plated with copper, and a bonding wire having 20-25mumphi is prepared. Cracks are easy to be generated in a surface layer on a deformation by contact bonding in a plating layer simple substance having proper hardness and brittleness or the bonding wire with a plating outer layer, and novel metallic surface exposed to a joint surface is made wider than conventional drawing-machined bonding wires. Pin hole diffusions and grain boundary diffusions are conducted easily, thus also increasing adhesive strength remarkably. |
