| 摘要 |
PURPOSE:The titled resin composition excellent in room temperature stability and good in curability, comprising an alicyclic epoxy resin, a polybasic acid hydrazide compound or dicyandiamide and an imidazole compound (derivative). CONSTITUTION:An epoxy resin is obtained by mixing 100pts.wt. polycyclic epoxy resin (e.g., diisodecylepoxy hexahydrophthalate) with 5-50pts.wt. polybasic acid hydrazide compound (e.g., succinic hydrazide) or 1-20pts.wt. dicyandiamide and 0.1-10pts.wt. imidazole compound or is derivative (e.g., 2-methylimidazole) and, if required, adding another curing agent or a filler to the mixture.
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