| 摘要 |
PURPOSE:The title composition which can photocure within a short time into a cured product excellent in toughness and adhesiveness, comprising a compound having an epoxy group and an unsaturated double bond, a polyepoxy resin, tetrahydrofurfuryl acrylate, a catalyst, a sensitizer, etc. CONSTITUTION:100pts.wt. total of 90-10twt% compound (A) having an epoxy group and an unsaturated double bond, obtained by reacting an epoxy resin such as bisphenol A polyglycidyl ether with an unsaturated compound such as acrylic acid and 10-90wt% polyepoxy resin (B) such as resorcinol novolak epoxy resin is mixed with 40pts.wt. or below tetrahydrofurfuryl acrylate (C), 0.001-15pts.wt. catalyst (D) which can initiate the polymerization of both of components A and B when irradiated with light, such as a mixed catalyst consisting of an organometallic compound such as organo-aluminum compound and a silicon compound which generates silanol groups upon irrdiation with light, 0.5-25pts.wt. linear polymer compound (E) soluble in component C [e.g., aromatic polyether sulfone of the formula (wherein m >=2)] and 0.001-15pts.wt. sensitizer.
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