| 摘要 |
PURPOSE:To make it possible to perform highly accurate position alignment with few erroneous recognition, by forming the area of a magnetic material on the surface of a semiconductor substrate or at specified positions in the semiconductor substrate. CONSTITUTION:Slender nickel patterns 2 are formed on the surface of a semiconductor substrate 1. Magnetization is carried out in an intense magnetic field so that the patterns 2 are used as positioning marks. The magnetic fields formed by the patterns 2 are converted into electric signals by a magnetic sensor such as a magnetic head and the like, and the semiconductor substrate 1 is moved. Then, a position, where the signal becomes the maximum value, can be found. This position is the position of each pattern 2. Since the positioning mark is slender, it is only the positioning mark in the Y direction. In order to perform position alignment in the X direction and for the amount of rotation of the semiconductor substrate 1, e.g., the slender nickel patterns 2 are provided at three points, and their positions are detected. |
