| 摘要 |
PURPOSE:To enable to obtain a wiring by performing a very simple process by a method wherein an electrode wiring is formed by injecting a fluid-state electrode wiring material from a nozzle. CONSTITUTION:The wafer 1 which is formed before an electrode wiring process is performed is arranged under nozzles 2. The nozzles 2 are arranged in such a manner that each nozzle 2 is positioned on the electrode part 3 of a semiconductor substrate 1. An electrode wiring material is flown into the nozzle 2 from an electrode wiring material storing part at a fixed pressure. An electrode wiring 4 is formed on the electrode part 3 by injecting a fixed quantity of the electrode wiring material. |
