| 摘要 |
PURPOSE:To develop the copper alloy material for a lead frame of semiconductor equipments excelling in strength, electric conductivity, and solderability by incorporating specific amounts of Zn, Sn, Fe, Co, etc., to a Cu-Ni-Ti alloy. CONSTITUTION:As the lead frame material for semiconductor equipments, any one of the following is used: a Cu alloy containing, by weight, 0.8-4.0% Ni, 0.2-0.4% Ti, 0.1-2.0% Sn, and 0.1-2.0% Zn and satisfying Ni%/Ti%=1-4; a copper alloy containing the above Ni, Ti, and Zn, and further 0.01-1.0%, in total, of Fe and/or Co; and a copper alloy containing the above Ni, Ti, Sn, and Zn, and Fe and/or Co. On making a lead frame out of the copper alloy having this composition, the lead frame excelling not only in electric conductivity but also in strength and solderability can be obtained. |
