发明名称 SOLID STATE IMAGE PICKUP ELEMENT
摘要 PURPOSE:To prevent the occurrence of flake flaws and printing after images, by burying a gap between electrodes with an insulator, and flattening a scanning IC substrate. CONSTITUTION:A region 12 corresponding to a gap between picture element electrodes 7 is buried by an insulator layer 13, whose thickness is about the same as the thickness of the electrode 7. Thus the stepped part due to the electrodes 7 is hardly present. Therefore, a photoelectric conversion film 8 is uniformly formed on the upper part of a scanning IC substrate. As a result, withstanding voltage of the photoelectric conversion film 8 becomes uniform in the entire body. The occurrence of leaking type flake flaws can be reduced. Since the photoelectric conversion film is not present in the gap part 12 between the electrodes, printing after images can be reduced to a large extent.
申请公布号 JPS61142770(A) 申请公布日期 1986.06.30
申请号 JP19850285518 申请日期 1985.12.20
申请人 HITACHI LTD 发明人 KOIKE NORIO;TSUKADA TOSHIHISA
分类号 H01L27/146;H04N5/335;H04N5/357;H04N5/369;H04N5/372;H04N5/374 主分类号 H01L27/146
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