| 摘要 |
PURPOSE:To take out an electrode from one surface and to take out an electrode from a back surface simply, by connecting a conductor layer part, which is extended to one end part on a tape substrate, to a connecting part, which is protruded and formed toward the side of a surface part at one end part of a base plate. CONSTITUTION:The thickness of a tape substrate 1 is set at about 100mum and thinner than the thickness of a semiconductor element chip 3, which is about 0.4mm. The substrate 1 is uniformly bonded to a base late 4 through an insulating reinforcing material 6. A conductor layer part 2a on the tape substrate 1 is electrically connected to a connecting part 4a, which is protruded and formed from the side of the surface of the base plate 4. An electrode at the back surface of the semiconductor element chip 3 is ohmic-contacted to a metal plated layer 5 of the base plate 4. Each end part of a conductor layer 2, which is patterned on the tape substrate 1, is electrically connected to each input and output terminal part on the other surface of the chip 3. A part of the semiconductor element chip 3 including each input and output terminal part is sealed by a sealing resin 7. |
