| 摘要 |
PURPOSE:To obtain excellent damp-proofing and high reliability by terminating an insulating film on the side inner than a dicing line region and coating the terminating surface of the insulating film with an inter-layer insulating film or apassivation film as the upper layer of the insulating film. CONSTITUTION:A polyimide resin film 6 having high hydroscopicity is coated completely with a passivation film 8 having low hydroscopicity, thus preventing the moisture absorption of the polyimide resin film 8. Accordingly, trouble on a semiconductor device having multilayer wiring structure, such as the corrosion of a wiring pattern, defective adhesion between an inter-layer insulating film and the wiring pattern, the deterioration of electrical characteristics such as leakage can be improved remarkably. |
