| 摘要 |
PURPOSE:To enable to perform a high-speed bonding by a method wherein a wire bonding operation is started based on the signal indicating that the terminal to be used for wire bonding comes in contact with the surface where the wire bonding is performed. CONSTITUTION:When the length of wire bonding surface varies in the amount of height of H1, H2 or H3 for the reference surface L1 when a wedge 1 comes down by the action of a motor circuit 17, the wedge 1 comes in contact with the surface of wire bonding at points t1, t2 and t3. At that time, a detection signal is outputted to a timer 15 from a detector 12, and an ultrasonic wave vibrator 4 is started oscillation after the lapse of time Ta necessary to attenuate the vibration of the wedge 1 by the timer 15, and an ultrasonic wave bonding is started. A signal is outputted to the timer 16 from the vibrator 4 at the same time when the wire bonding is finished, a motor 11 is inversely rotated at a high speed, and the wedge is moved upward and returned to its original position through the intermediate of a cam 9. Accordingly, a bonding work can be performed at a high speed without having a waiting time even when irregularity in size is generated on a semiconductor device. |
