| 摘要 |
Apparatus is presented for removing a faulty component from a printed circuit board when attachment is by a plurality of input/output pins that extend outwardly from the component and protrude through holes in the printed circuit board where they are then soldered to printed circuitry. Removal is accomplished by clamping the printed circuit board in a fixture which includes a container of molten solder together with aligning and retaining elements which support the board over the surface of the molten solder so as to bring the protruding tips of the input/output pins into contact therewith. Above the clamped down printed circuit board a movable trolley is situated on a beam located parallel to and several inches above the printed circuit board. Extending downward from the trolley is a tubular metal bellows on the lower end of which is a rubber suction cup. The upper end of the bellows connects via flexible tubing to a vacuum pumping source. The trolley is moved along the beam until the suction cup can be made to contact the top surface of the faulty component. Application of a vacuum causes the tubular bellows to shrink in length creating a uniform pulling force on the component which draws it free from the printed circuit board as soon as the solder is melted from the downward extending pins.
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