Method for producing a metal lithographic plate

摘要

A method for producing a metal substrate for a lithographic plate is provided herein by treating the substrate having the thickness in the range of 50 to 400 mu m. The said substrate is electrochemically, chemically or mechanically treated in order to provide an average surface roughness in the range of 0.1 to 3 mu m, followed by a surface treatment such as plating or chemical treatment, and then followed by a conventional hydrophilic treatment.