| 摘要 |
PURPOSE:To prevent the lowering of damp-proofing due to a mounting to a substrate by forming the shape of a molding section to a chevron on viewing from a plane and obviating an extension to the upper section of a line tying the center line of a pair of fitting holes shaped to a header of the upper edge of a central section. CONSTITUTION:A molding section 19 has predetermined thickness, and covers a semiconductor element 13, wires 16 and the inner end sections of leads 17. The plane of the molding section 19 takes a Conidae-shaped chevron, a top section thereof extends between a pair of fitting holes 12, and skirt sections thereof stretch along sections in the vicinity of the fitting holes 12. Since the deformation of a header section is reduced with a separation from the fitting holes 12 even when a mounting substrate, etc. are warped when a power semiconductor device is clamped and fixed to the mounting substrate, etc. by utilizing the fitting holes 12, the positions of corner edges are separated from the fitting holes 12, thus hardly deforming the header section in the lower sections of the corner edges. Accordingly, a joining section on a boundary between the header section and the molding section 19 is not peeled, thus preventing the lowering of damp-proofing and reliability. |
