发明名称 MANUFACTURE OF SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To form a convex lens array in response to a photoelectric conversion element group by coating a main surface with a first transparent resin layer and a second resin layer, removing the second resin layer in a section corresponding to the conversion element group and diffusing a third transparent resin into an opening section for the second resin layer. CONSTITUTION:Photoconductive conversion regions 11 consisting of devices such as photodiodes are arranged to the main surface of a semiconductor substrate 10, and vertical CCD registers and transfer gate regions are light-shielded by layers 13. A CCD image pickup device is shaped to the main surface 10 of the semiconductor substrate, and coated with a hydrophobic resin layer 14, and bonding pads for the image pickup device and the resin layer 14 on a scribing line are removed. The resin layer 14 is coated with a resin layer 15 in which potassium dichromate is mixed to a hydrophilic resin as a photosensitizer, and the hydrophilic resin layers 15 in sections 16 corresponding to the photoelectric conversion regions 11 are removed by a photochemical reaction. Transparent hydrophobic dyes 17 are heat-transferred and dyed. The hydrophobic resin layers in sections to which dyes 17 are dyed are formed to a projecting section shape by cubical expansion.
申请公布号 JPS6164158(A) 申请公布日期 1986.04.02
申请号 JP19840186827 申请日期 1984.09.06
申请人 NEC CORP 发明人 ISHIHARA YASUO
分类号 H01L27/14;H01L31/0232;H04N5/335;H04N5/341;H04N5/3728;H04N5/374 主分类号 H01L27/14
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