| 摘要 |
PURPOSE:To contrive to upgrade bondability at the time of bonding by a method wherein a fixing frame or a fixing plate is attached to the lead frame, the leads are securely fixed on the fixing frame or the fixing plate, and moreover, the fixing frame or the fixing plate is attached to the semiconductor element connected to the leads. CONSTITUTION:The semiconductor element is mounted on the tab 3 of the lead frame and this semiconductor element and the leads 4 are electriclly connected using connector wires. One end part of each connector wire and the electrode terminals of the semiconductor element are bonded, and the other end part of each connector wire and the point part of each lead 4, which is installed on a lead fixing frame 5, are bonded. Or the semiconductor element is mounted on a fixing plate 7 and both is bonded in the same manner. As the material for the connector wires is used Al, copper and gold, for example. After this wire-bonding, the necessary places are resin-sealed. By this way, since the leads are securely fixed, the bondability can be improved at the time of bonding. |
