| 摘要 |
PURPOSE:To prevent any inclination of products in transit from happening by a method wherein, when the tips of three leads projecting from the bases of semiconductor devices are bonded on the surface of a pasteboard utilizing radial tapes, flat sheet type wide parts are fixed to the tips of leads situated on both sides. CONSTITUTION:When tips of three leads 23a, 23b, 23c projecting from resin sealers 22 at the bases of semiconductor devices 21 are bonded on the surface of a pasteboard 26 utilizing radial tapes 24, flat type wider parts 24 in parallel with the pasteboard 26 are fixed to the tips of leads 23a, 23b situated on both sides of the leads excluding the central lead 23c. Through these procedures, the operation rate of automatic device for user's side may be improved preventing any inclination of semiconductor device 21 in transit from happening. |
