| 摘要 |
PURPOSE:To enhance the durability and the reliability of the titled semiconductor device by a method wherein a structure, in which photo curing resin is coated on the through hole of a lead, having a large calibered main surface to be used to place a semiconductor chip, and on the back side part located on the circumference, is provided. CONSTITUTION:A semiconductor chip 2 is fixed by adhesion on the large calibered main surface of a lead part 1 using a soldering material 3, and each electrode located on the chip 2 is connected using each outside lead and fine metal wire. Then, photo curing resin is coated on the inner surface and the circumferential part of the through hole 6 of the lead part 1, and after a thin resin layer 8 is hardened by ultraviolet rays, the entire region is sealed by casing forming resin 4 and 5. In this case, molding resin 4 is filled in the through hole 6 of the lead part 1 leaving a mounting hole 7. |
