| 摘要 |
PURPOSE:To form a stable-shaped bump without leaving a bonding wire portion to be removed, by a method in which, after a ball which has been formed by melting fine metal wire is pressed against an electrode pad of a device and a bonding capillary is again raised and then pressed against the ball, the fine metal wire is cut so that only the bump of the ball can be formed on the electrode pad. CONSTITUTION:A bonding capillary 1 is lowered to press and heat-weld a gold ball against a bonding pad 6. Next, after the capillary 1 is raised a little and then is displaced a little transversely, the capillary 1 is again lowered to create a narrow part of the gold wire 2 just above the gold ball 3. Next, the capillary 1 and the gold wire are raised simultaneously. At this time, the gold wire 2 is cut at the narrow part. By repeating this operation by the number of bonding pads of the semiconductor device chip in the similar way, the semiconductor device chip with gold bumps can be easily manufactured. |
