| 摘要 |
A wafer (1) on which is formed a layer of thin film as an interconnection system (3) with contact sites (2, 7) between the interconnection system (3) and die bonding sites (2) of the wafer (1) to form a monolithic wafer. The interconnection system (3) has bonding sites on the surface of the wafer (1) to which chips are bonded to form a hybrid monolithic wafer system. |
