发明名称 SEMICONDUCTOR MANUFACTURING PROCESS CONTROLLING SYSTEM
摘要 PURPOSE:To contrive accomplishment of a highly precise control over the semiconductor manufacturing process as well as to expedite said control by a method wherein a measuring process is provided between each treatment process, and the condition of each treatment process is established based on the measured data of the adjoining measuring process. CONSTITUTION:A measuring process is provided between each process constituting the manufacturing process of a semiconductor device. Each process 1 is controlled by a controlling part 3 based on the data obtained by the measuring process 2 located adjoining to the process 1. To be more precise, a controlling signal Si+1 is formed by the controlling part 3 based on the measured data Ti sent from the measuring process 2 and the desined data M given from outside, and the controlling signal is inputted to the treatment process 1. A treatment is performed based on said controlling signal by the treatment process 1. As a result, the control of a treatment process is automated, the control is performed in a highly precise manner, the speed of control is improved, and also the stability of control can be improved.
申请公布号 JPS60247937(A) 申请公布日期 1985.12.07
申请号 JP19840102556 申请日期 1984.05.23
申请人 HITACHI SEISAKUSHO KK 发明人 TAKEUCHI MASARU;KADOTA KAZUYA;TANUMA MASAYA;OONARI MIKIHIKO
分类号 H01L21/50 主分类号 H01L21/50
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