| 摘要 |
PURPOSE:To obtain superior electroplating resistance, and tough film strength by incorporating ethylenically unsatd. compds. represented by formulae I, II, an org. halogenated compd., a film-forming property giving polymer, and a sensitizer and/or a sensitizer system capable of producing free radicals upon exposure to actinic rays. CONSTITUTION:It is preferable to use 0.5-10pts.wt. of the sensitizer and/or the sensitizer system capable of producing free radicals upon exposure to actinic rays, and 0.2-10pts.wt. of the org. halogenated compd. per 100pts.wt. of the film-forming polymer and the ethylenically unsatd. compds. presented by formulae I and II in which R<1>, R<2> are each H or methyl; m is an integer of 1 or 2; a, b are each an integer and a+b=6, R1 is H or methyl; and X is ethyl or hydroxymethyl. The ethylenically unsatd. compd. represented by formula I has 6 functional groups, and high cross-linking density after light irradiation, and since it has many radically polymerizable unsatd. groups in one molecule, photoreaction speed is high. The ethylenically unsatd. compd. represented by the formula IIis hydrophobc, and extremely low in affinity to an electroplating soln.. The use of the combination of both said compds. can enhance resistance to plating solns., especially, pyrophosphoric acid, remarkably. |
