发明名称 LEAD FRAME
摘要 PURPOSE:To obtain the titled frame with high heat-dissipation property excellent in bondability with Au wires, hardness, bendability, oxidation-resistance, and solderability, by cladding both surfaces of a plate of Fe alloy with a thin plate of Cu or Cu alloy. CONSTITUTION:Both surfaces of a plate of 42 alloy or kovar are clad with a precipitation hardening type Cu alloy to a thickness of 20mum or more. This Cu alloy can be obtained by melting Cu containing Cr 0.1-1wt% and Zr 0.05- 0.5wt% at 400-500 deg.C, casting it continuously, hot-rolling and cold-rolling it, heat- treating it to melt, then cold-working it, and hardening it to deposit. Thereafter, the lead frame is produced by forming to a required shape. This construction can yield the lead frame excellent in various kind of characteristics such as bendability and the like.
申请公布号 JPS60206053(A) 申请公布日期 1985.10.17
申请号 JP19840059455 申请日期 1984.03.29
申请人 TOSHIBA KK 发明人 YASUI TAKESHI;YAMANE SHIGEMI
分类号 H01L23/50;H01L21/60;H01L23/48;H01L23/495 主分类号 H01L23/50
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